Tyknoi series light curing resin can strictly control the peak curing temperature below 100°C in the commonly used curing sample mold size, so as to protect the size and position of most temperature sensitive materials to maintain true reproduction.

The Tyknovi series of light cured resin uses a high elastic modulus 50% higher than the market to improve the material compatibility of the mosaic resin, so as to keep the mosaic resin synchronized with all kinds of sample materials in the plane grinding.

Through segmented or layered curing, effectively control the curing time, can make the resin to the microstructure fully infiltrated and embedded, in vacuum conditions or air pressure conditions are also applicable. The minimum embedding space is 10 microns, which will not strip the sample surface by resin, such as samples from coating materials and wiring measurement of circuit boards.